Application Note 9855
Appendix A Description of Architecture
The segmented current source architecture has the ability to
improve the converter’s performance by reducing the amount
of current that is switching at any one time. In a segmented
current source arrangement, transitions such as midscale
become one in which you simply have an additional
intermediate current source turning on and several minor
ones turning off. In the case of the HI5760 10-Bit DAC, there
are 31 intermediate current segments that represent the 5
MSBs and five, binary-weighted current sources representing
each of the five LSBs. See the Functional Block Diagram in
the datasheet for a visual representation. To relate the
HI5828 Pin Descriptions
midscale transition example to the HI5760, consider the
following: The code 0111111111 would be represented by 15
intermediate current segments and each of the 5 LSB current
sources all turned on. To transition to code 1000000000 would
simply require turning off the 5 LSB current sources and
turning on the next intermediate current segment, bringing the
total amount of current switching at this ‘major’ code transition
equal to the same amount switching at 30 other code
transition points in the code ramp from 0 to 1023, so that the
total glitch energy is distributed more evenly. The HI5828 uses
this technique but with a 5 MSB/7 LSB split.
PIN NO.
11, 19, 26
13, 24
28
27
10
20
14, 23
12, 25
NAME
AGND
A VDD
CLK
DGND
D VDD
FSADJ
ICOMP1, QCOMP1
ICOMP2, QCOMP2
DESCRIPTION
Analog Ground.
Analog Supply (+3V to +5V).
Clock Input. The master and slave latches shown in the functional block diagram are simple D-latches.
Input data to the DAC passes through the “master” latches when the clock is low and is latched into the
“master” latches when the clock is high. Data presented to the “slave” latch inputs passes through when
the clock is high and is latched into the “slave” latches when the clock is low. This master-slave
arrangement comprises an edge-triggered flip-flop, with the DAC being updated on the rising clock edge.
Connect to Digital Ground.
Digital Supply (+3V to +5V).
Full Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output
Current = 32 x V FSADJ /R SET . Where V FSADJ is the voltage at this pin. V FSADJ tracks the voltage on the
REFIO pin (refer to the functional block diagram); which is typically 1.2V if the internal reference is used.
Compensation Pin for Use in Reducing Bandwidth/Noise. Each pin should be individually decoupled to
AVDD with a 0.1 μ F capacitor. To minimize crosstalk, the part was designed so that these pins must be
connected externally, ideally directly under the device packaging. The voltage on these pins is used to
drive the gates of the PMOS devices that make up the current cells. Only the ICOMP1 pin is driven and
therefore QCOMP1 needs to be connected to ICOMP1, but de-coupled separately to minimize crosstalk.
Compensation Pin for Internal Bias Generation. Each pin should be individually decoupled to AGND with
a 0.1 μ F capacitor. The voltage generated at these pins represents the voltage used to supply power to
the switch drivers (refer to the functional block diagram) which is 2.0V nominal. This arrangement helps
to minimize clock feedthrough to the current cell transistors for reduced glitch energy and improved
spectral performance.
43-48, 1-6,
29-40
ID11-ID0, QD11-QD0 Digital Data Input Ports. Bit 11 is Most Significant Bit (MSB) and bit 0 is the Least Significant Bit (LSB).
15, 22
16, 21
7, 8, 41, 42
17
18
9
IOUTA, QOUTA
IOUTB, QOUTB
NC
REFIO
REFLO
SLEEP
Current Outputs of the Device. Full scale output current is achieved when all input bits are set to binary 1.
Complementary Current Outputs of the Device. Full scale output current is achieved on the
complementary outputs when all input bits are set to binary 0.
No Connection.
Reference voltage input if Internal reference is disabled. Use 0.1 μ F cap to ground when internal reference
is enabled.
Reference Low Select. To enable the internal reference, connect REFLO to analog ground. To disable
the internal reference circuitry this pin should be connected to A VDD .
Control Pin for Power-Down Mode. Sleep Mode is active high; connect to ground for Normal Mode. Sleep
pin has internal 20 μ A (nominal) active pull-down current.
3-4
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相关代理商/技术参数
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HI5860 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 125MSPS, CommLinkTM High Speed D/A Converter
HI5860 WAF 制造商:Intersil Corporation 功能描述:
HI5860_05 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 130MSPS, High Speed D/A Converter
HI5860_08 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 130MSPS, High Speed D/A Converter
HI5860IA 功能描述:CONV D/A 12BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*
HI5860IA-T 功能描述:CONV D/A 12BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*
HI5860IB 功能描述:CONV D/A 12-BIT 130MSPS 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*